We are having a very difficult time trying to obtain uniform deposition of Au by electroplating in selective areas. We use TSG-250 solution.
Looking for some positive inputs from experienced users.
Thanks and Regards
What is your substrate? is your substrate conducting then you have to support it on a thick metal desc such that the current is forced to be distributed uniformly at the whole surface of the substrate. The other precaution is to mask the areas free of gold by an adhesive tape or photoresist film shaped by photo lithography.
The third precaution is to make the counter electrode area eqaul to the working electrode area and finally you have to stir the solution to homogenize it.
Best wishes
It'll better if you electroplate Au within ionic liquid medium
Abbott, Andrew P., Gero Frisch, and Karl S. Ryder. "Electroplating using ionic liquids." Annual Review of Materials Research 43 (2013): 335-358.
Thank You Prof. Abdelhalim Zekry and Dr Azeez Barzinjy for your responses.
I will try to follow these suggestions.
Thnaks
You may use; seed layer at first, than pattern via lithography (desired area should be open), Au EP deposit. then you can remove seed layer by a proper way (wet etch or dry etch with the use of photolithography)
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