——Call for Papers——
CMC-Computers, Materials & Continua new special issue“The Latest Deep Learning Architectures for Artificial Intelligence Applications”is open for submission now.
Submission Deadline: 31 December 2024
👨🎓 Guest Editors
Prof. Lizhuang Ma, Shanghai Jiao Tong University, China
Dr. Xin Tan, East China Normal University, China
Dr. Zhiwen Shao, Hong Kong University of Science and Technology, China
Prof. Yong Peng, Central South University, China
📝 The scope of the special issue is expansive, encompassing original research articles, review papers, and case studies that shed light on the latest advancements in deep learning architectures for AI applications. Topics of interest include but are not limited to cutting-edge architectures, optimization techniques, transfer learning methodologies, and applications spanning healthcare, autonomous vehicles, smart cities, and beyond.
📚 For submission guidelines and details, visit: https://www.techscience.com/cmc/special_detail/deep-learning-architectures
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