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I have been using RIE to etch Silicon to release the diaphragm (various thickness: 50 micron to 10 micron), Etching recipe that I am using is SF6: O2 (50:5), pressure 15 mtorr, power 200W. I have...
03 July 2019 2,280 4 View
I am having a drop-casted device, which i want to passivate, we are not having pecvd to deposit sio2 or sin. So what material and method i can use for passivation.
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