Tasneem Fatema

2 Questions 5 Answers 0 Followers

Questions related from Tasneem Fatema

What can be a reason for getting deformed mesa shape during InP/InGaAs wet etching?

I am doing wet etching of InGaAs/InP epixay using HCl:H3PO4:DI and H2SO4:H2O2:DI. I used AZ 5214 photoresist (thickness ~1.9um). I found that, while wet etching, my mesa shrinked and got deformed...

08 April 2025 6,851 5 View

What can be a potential reason for crack in the sample after dry etching SiO2 using CHF3?

I did SiO2 dry etching using CHF3 (100 W RIE power, 10 mT pressure, 20 sccm CHF3 flow) at 20C. After the etch process, I noticed cracks/peeling off in multiple places of my sample (image...

19 July 2023 7,708 3 View