2 Questions 10 Answers 0 Followers
Questions related from Chiranjeevi Lakavath
During dicing time we are facing lot of silicon debris on the device area. Dicing machine uses DI water along with surfactant, which is not helpful for removal of debris. Device has 30 micron...
23 February 2017 9,945 8 View
I am trying to fabricate microthruster on 6 inch Silicon wafer, which consist of chamber, channel and nozzle. When i am etching Si by KOH etchant, the channel area is merging with nozzle and...
24 August 2015 4,084 12 View
