We don't have any facility related to TEM, and I am working on blanks (Disc 25 mm).
subsuracfe damage could be the creation of microcracks. If there is one domiant crack you could use fracture mechanics concepts
Kindly suggest where to publish an article. Full Article or Short Communication.
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Is Critical Depth of Cut and ductile regime is similar or different?
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Wafer thickness is 100 microns? Is their any protocol to be followed for the sample preparation for TEM.
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Anyone can help me to get the difference; full articles, solicited reviews or commentary, and unsolicited reviews or commentary, related to the publication?
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