I have been searching for literature on this subject, but apparently much of the Accumulative Roll Bonding work has been performed on conventional materials. There are situations where the material must be 5N purity and the grains be stabilized (or relatively stabilized) during thermal exposures of 0.8Tm. Is there any previous work done on such systems? How about materials that negligibly oxidize like Pt or Au? What could potentially be the mechanism for grain stabilization such systems? Could grain stabilization be achieved by the interlayer voids that never completely go away during the bonding process much like how voids in powder metallurgically processed W stabilize the grains in that material to inhibit the "bambooing" of W wire.