May be you are using plasma deposition method like magnetron sputtering or PECVD.

To change the material from macroporous to microporous you have to change the operating or deposition pressure. At low pressure ~ 3-10 mTorr, the film will be less porous (micro). When you will enhance gas flow the film will be macro porous.

You have to characterize the deposition process using pressure. May be you have to look for literature.