01 January 1970 0 5K Report

CMC-Computers, Materials & Continua new special issue “Enhancing IoT Cyber-Resilience: Convergence of AI, Digital Twins, and the Metaverse” is open for submission now.

📆 Submission Deadline: 30 October 2024

📚 This special issue aims to explore innovative strategies for strengthening IoT ecosystems against dynamic and evolving cyber threats. By harnessing the transformative potential of AI, Digital Twins, and the Metaverse, we seek to provide practical insights and solutions to fortify IoT cyber-resilience in the swiftly evolving digital epoch.

👉 Submit your work and be a part of this dynamic special issue. Learn more: https://www.techscience.com/cmc/special_detail/IoT_cyber-resilience

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